Formed with Corning's fusion draw process, it combines ultra-low alkali content, an excellent pristine surface, low thermal expansion and high dimensional stability, suited to wafer-level optics, display and microelectronic substrates.
EAGLE XG® is an alkali-free alkaline earth boro-aluminosilicate glass that contains no heavy metals such as arsenic, antimony or barium. Its thermal expansion is close to that of silicon, and it offers a relatively high strain point, optical transparency, chemical durability and inherent dimensional stability, making it suitable for wafer-level optics, electronic devices and display substrate projects.
Corning's proprietary fusion draw process lets the glass form a flat thin sheet in air with stable thickness control. For wafer-level optics and semiconductor processing, surface roughness, TTV, warpage, edge condition and clean packaging must be confirmed alongside the material grade.
The material's average coefficient of linear thermal expansion from 0–300 °C is 3.4 × 10⁻⁶/°C and its strain point is 669 °C; the high thermal stability benefits downstream high-temperature processes. EAGLE XG® has a total alkali content of about 0.1 wt%, with typical values below 0.05 wt%.
| Material and forming | Alkali-free alkaline earth boro-aluminosilicate glass; fusion drawn |
|---|---|
| Density | 2.38 g/cm³ |
| Young's modulus | 73.6 GPa |
| Poisson's ratio / shear modulus | 0.23 / 30.1 GPa |
| Vickers hardness | 640 kgf/mm² (200 g load) |
| Fracture toughness | 0.89 MPa·m0.5 |
| Coefficient of thermal expansion (CTE) | 3.4 × 10⁻⁶/°C（0–300°C；20–260°C） |
| Softening point / annealing point / strain point | 971°C / 722°C / 669°C |
| Thermal conductivity | 1.10 W/(m·K)（25°C）；1.42 W/(m·K)（500°C） |
| Refractive index | 1.5159（480 nm）；1.5097（589.3 nm）；1.5004（1,000 nm） |
| Abbe number | 62.7 |
| Dielectric constant / loss tangent | 5.28 / 0.002（100 MHz）；5.14 / 0.008（10 GHz） |
| Volume resistivity | log10 ρ = 22.92 Ω·cm（25°C）；12.98 Ω·cm（250°C） |
| Weathering class | Class 1 |
| Total alkali content | Approximately 0.1 wt%; typical value below 0.05 wt% |
The following are the standard capabilities listed in the Corning Precision Glass Solutions data sheet; stock, minimum order quantity and lead time are confirmed per project.
100 · 150 · 200 · 300 mm
0.20 · 0.21 · 0.25 · 0.30 · 0.40 · 0.50 · 0.70 mm
Outline ±0.3 mm; thickness ±0.01 mm; scratch/dig 60/40 to 20/10; Ra ≤ 10 Å
Tighter dimensional, thickness, surface and edge requirements can be assessed against the drawing; formal acceptance is governed by the specification confirmed by both parties.
Processing focuses on minimising surface contact and treating fixturing, edges, cleaning, inspection and packaging as one continuous flow.
Precision glass processing services. Precision glass grinding. For borosilicate glass, aluminosilicate glass, …
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We plan the glass cutting route around dimensions, datums, edge condition and downstream operations, reviewing outline, cutting allowance and delivery requirements against the drawing.
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Grinding and polishing operations are arranged around thickness, parallelism, flatness and surface requirements, with the process route and inspection method confirmed per project.
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We control particles, residues and water marks after processing, and confirm cleaning, handling and packaging requirements against coating, bonding or assembly needs.
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Glass dimensions, edges and surfaces are inspected against the drawing and the agreed acceptance items, with inspection methods, sampling scope and delivery records defined.
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We address sharp edges and local edge defects after cutting, confirming edge grinding and chamfer styles and edge acceptance criteria against assembly requirements.
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For micro-holes, hole arrays and local openings in glass, we evaluate laser drilling options based on material, thickness and hole geometry.
View ProcessingMaterial selection still needs to be confirmed against temperature, structure, thickness, surface and downstream processes together.
It is an alkali-free alkaline earth boro-aluminosilicate glass produced with Corning's fusion draw process, intended for display, wafer-level optics and microelectronic substrate applications.
The published data sheet lists 100, 150, 200 and 300 mm wafers and thicknesses of 0.20, 0.21, 0.25, 0.30, 0.40, 0.50 and 0.70 mm; actual stock and lead time are confirmed by enquiry.
Tighter dimensional, thickness, surface and edge requirements can be discussed per project; final capability is subject to drawing assessment and the confirmed specification.
Tiny edge chips can affect handling, assembly and service strength, so the cutting path, fixturing, edge treatment and protective packaging must be planned together.
Please provide outline, thickness, quantity, tolerances, edges, surface, clean packaging, application and lead time; include a drawing if available.
Provide the wafer or sheet size, thickness, quantity and key acceptance items, and we will match cutting, edge, cleaning and inspection processes to the material's characteristics.