Combining thermal expansion close to silicon, optical transparency, dielectric performance and wafer-processing consistency, it suits MEMS, sensor and microfluidic projects.
Material selection starts from thermal matching, surface quality, thickness consistency and the bonding process, and is then translated into inspectable drawing requirements.
Typical CTE from 0–300 °C is 3.43 × 10⁻⁶/°C, suitable for evaluating anodic bonding and wafer-level packaging.
Delivery specifications can be built around wafer diameter, thickness, TTV, warpage and edge form.
With visible-light transparency and published dielectric parameters, it can be used in optical sensing and microelectronic structures.
PYREX® Micro-Electro is a borosilicate glass intended for microelectronic and wafer-level applications, suited to projects needing glass–silicon thermal matching, optical windows, electrical insulation or package lids.
What usually affects delivery is not the material name itself but thickness, TTV, warpage, edge quality, surface cleanliness and packaging. We assess these against the drawing together with cutting, lapping, polishing, cleaning and inspection.
| Density | 2.234 g/cm³ |
|---|---|
| Young's modulus | 61.5 GPa |
| Poisson's ratio / shear modulus | 0.19 / 25.8 GPa |
| Vickers hardness | 520 kgf/mm² (200 g load) |
| Coefficient of thermal expansion (CTE) | 3.43 × 10⁻⁶/°C（0–300°C） |
| Softening point / annealing point / strain point | 814°C / 546°C / 498°C |
| Thermal conductivity | 1.10 W/(m·K)（50°C）；1.56 W/(m·K)（500°C） |
| Refractive index | 1.472（589.3 nm） |
| Dielectric constant / loss tangent | 4.68 / 0.0041（0.5 GHz）；4.55 / 0.0084（10 GHz） |
| Volume resistivity | log₁₀ ρ = 8.01 Ω·cm（250°C） |
Standard and custom capability must be confirmed against stock, batch, process route and project acceptance conditions.
0.20 · 0.50 · 0.70 · 0.85 · 1.10 · 1.40 mm
Wafer specifications confirmed per project; panels can be assessed up to 600 × 600 mm
TTV, warpage, thickness tolerances and surface requirements confirmed against the drawing and process together
Wafer TTV can be assessed to ≤1 μm; panel and wafer warpage capability depends on dimensions, thickness and measurement conditions; formal metrics must be written into the confirmed specification.
The process route is designed around low-damage edges, thickness consistency, surface cleanliness and downstream process compatibility.
Precision glass processing services. Precision glass grinding. For borosilicate glass, aluminosilicate glass, …
View Processing
We plan the glass cutting route around dimensions, datums, edge condition and downstream operations, reviewing outline, cutting allowance and delivery requirements against the drawing.
View Processing
Grinding and polishing operations are arranged around thickness, parallelism, flatness and surface requirements, with the process route and inspection method confirmed per project.
View Processing
We control particles, residues and water marks after processing, and confirm cleaning, handling and packaging requirements against coating, bonding or assembly needs.
View Processing
Glass dimensions, edges and surfaces are inspected against the drawing and the agreed acceptance items, with inspection methods, sampling scope and delivery records defined.
View Processing
We address sharp edges and local edge defects after cutting, confirming edge grinding and chamfer styles and edge acceptance criteria against assembly requirements.
View Processing
For micro-holes, hole arrays and local openings in glass, we evaluate laser drilling options based on material, thickness and hole geometry.
View ProcessingSuitability should be validated against temperature cycling, structural stress, bonding method, optical band and cleanliness requirements.
This material is intended for microelectronic and wafer-level applications, and purchasing places more emphasis on inspectable metrics such as TTV, warpage, surface, edges and cleanliness.
Its thermal expansion makes it suitable for glass–silicon bonding evaluation, but voltage, temperature, surface and cleanliness still need to be validated for the specific equipment and structure.
Published documentation lists a range of wafer and thin-sheet specifications; actual available sizes, quantities and lead times are confirmed by enquiry against the drawing.
We can assess this, but capability depends on dimensions, thickness, processing allowance and measurement method and must be confirmed before ordering.
Please provide outline, thickness, quantity, TTV, warpage, edges, surface, clean packaging, application and lead time.
Send the drawing, quantity and key acceptance items, and we will confirm material, process route, inspection method and lead time accordingly.