For UV optics, laser windows, semiconductor equipment and high-temperature structural parts, the material grade and hydroxyl content must be selected according to the operating band and service environment.
Fused silica is not a single specification; UV, IR, low-hydroxyl, high-purity and semiconductor applications have different raw material and inspection documentation requirements.
Dimensional change under thermal cycling is small, making it suitable for precision optics and high-temperature equipment.
The appropriate grade can be selected for UV, visible or near-infrared operating bands.
Suited to projects sensitive to metal impurities, outgassing, thermal stability or clean delivery.
Fused quartz glass is based on amorphous silicon dioxide and offers low thermal expansion, good optical transmission and high-temperature resistance. Different manufacturing routes affect hydroxyl content, impurities, bubbles, striae and spectral behaviour.
Enquiries should specify the operating band, thermal environment, dimensions and thickness, surface quality, edge form and cleanliness requirements. For vacuum, laser or semiconductor scenarios, coating, bonding, particle or trace-element limits should also be stated.
| Material composition | High-purity amorphous SiO₂; exact purity and hydroxyl content confirmed by grade |
|---|---|
| Density | 2.201 g/cm³ |
| Young's modulus / shear modulus | 72.7 / 31.4 GPa |
| Poisson's ratio | 0.16 |
| Knoop hardness | 522 kg/mm²（100 g） |
| Softening point / annealing point / strain point | 1585°C / 1042°C / 893°C |
| Thermal conductivity | 1.30 W/(m·K) |
| Coefficient of thermal expansion (CTE) | 0.52 ppm/K（5–35°C）；0.57 ppm/K（0–200°C） |
| Hydroxyl and impurities | Varies with manufacturing grade; to be confirmed per project |
| Stress birefringence | Confirmed against the optical grade and measurement conditions |
Sheet source, grade, dimensions and thickness are confirmed against the application, drawing and stock.
UV, visible, near-infrared and low-hydroxyl directions selected per project
Outline, thickness, TTV, flatness, parallelism and chamfers confirmed against the drawing
Scratch/dig, Ra, subsurface damage, cleaning and packaging confirmed by application
Formal supply is governed by material documents, drawings, sample validation and specifications confirmed by both parties.
Processing hard, brittle materials requires simultaneous control of edge defects, subsurface damage, dimensional consistency and cleanliness.
Precision glass processing services. Precision glass grinding. For borosilicate glass, aluminosilicate glass, …
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We plan the glass cutting route around dimensions, datums, edge condition and downstream operations, reviewing outline, cutting allowance and delivery requirements against the drawing.
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Grinding and polishing operations are arranged around thickness, parallelism, flatness and surface requirements, with the process route and inspection method confirmed per project.
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We control particles, residues and water marks after processing, and confirm cleaning, handling and packaging requirements against coating, bonding or assembly needs.
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Glass dimensions, edges and surfaces are inspected against the drawing and the agreed acceptance items, with inspection methods, sampling scope and delivery records defined.
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We address sharp edges and local edge defects after cutting, confirming edge grinding and chamfer styles and edge acceptance criteria against assembly requirements.
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For micro-holes, hole arrays and local openings in glass, we evaluate laser drilling options based on material, thickness and hole geometry.
View ProcessingThe material grade must be validated against the operating band, energy density, thermal load, atmosphere and downstream processes.
Fused quartz is based on high-purity SiO₂ and generally offers lower thermal expansion, higher temperature resistance and a wider choice of spectral range.
No. UV transmission depends on the manufacturing route, hydroxyl content, impurities and thickness, so the grade must be selected for the target band.
We can assess wafers, rectangular sheets, round holes, slots and other outlines; actual capability depends on thickness, tolerances and surface requirements.
Cutting, lapping, polishing, cleaning and inspection must be treated as one continuous flow, with permitted values stated on the drawing.
Please provide the material grade or operating band, outline, thickness, quantity, tolerances, surface, edges, cleanliness and service environment.
We assess supply and precision processing against the service environment, material grade, drawing and inspection conditions.