ТЕХНИЧЕСКОЕ РУКОВОДСТВО
Small glass parts determine optical path and package stability
Although Bars, Lids, V-groove cover plates, windows and Spacers are small, they directly affect fiber position, beam deflection, adhesive layer thickness, device protection and thermal stress. Outline, thickness, parallelism, end faces, chipping and cleanliness must match the actual function.
Applications
Where it can be used
- Windows for optical modules, transceiver assemblies and optoelectronic packaging
- Fiber arrays, PLC splitters, AWG and couplers
- Lasers, detectors, optical isolators and monitoring components
- V-groove cover plates, Bars, Lids, Spacers and transparent shims
- Fiber sensing, silicon photonics and micro-optical assemblies
Material Selection Logic
Why glass
Glass provides target-band transmission, electrical insulation, dimensional stability, ageing resistance and a precisely machinable assembly interface. Fused silica suits low CTE and high stability; BOROFLOAT® 33 balances thermal stability, machinability and cost; A selected alkali-free grade may suit thin electronic substrates when ion content, surface quality and thermal stability are verified.
Material Selection
Common materials and their applications
| Material | Applications | Selection focus |
|---|
| Fused quartz / JGS1 | Laser windows, precision lids and low-CTE structures | Validated at 850/1310/1550 nm, with thickness and coating |
| BOROFLOAT® 33 | Bars, Lids, V-groove cover plates, windows and Spacers | Typical transmission band about 250-2800 nm, low expansion |
| Alkali-free glass substrates | Thin lids and substrates for microelectronics and silicon photonics | Confirm grade-specific ion content, surface quality and dimensional stability |
| Borosilicate glass for qualified bonding | MEMS optical packaging and glass-silicon lids | Confirm silicon compatibility, bonding recipe, surface condition and wafer specifications |
Typical Parameters
Common enquiry parameters
| Item | Common starting points or wording | Engineering notes |
|---|
| Working wavelength | Commonly 850, 1310, 1550 nm or customer-specified | Provide the target transmission, incidence angle and whether AR coating is applied |
| Толщина | Commonly 0.10-3.00 mm | Affects stiffness, optical path length and the parallel relationship |
| Narrow strip width | Minimum evaluable down to 1 mm | Confirmed together with length, thickness and handling |
| Outline tolerance | Precision Bar/Lid can be evaluated to ±0.03 mm | Specify the reference and inspection method |
| Edge chipping | Precision small parts assessable to <0.10 mm | Tighter limits may apply near fibers, adhesive seals and optical paths |
| Surface quality | General optical surfaces from 60/40; precision windows evaluated from 40/20 or better | State the standard and clear aperture |
| Parallelism / wedge angle | Determined by beam deflection, return light and assembly height | Parallel windows and controlled wedge angles serve different purposes |
| Groove profile / pitch | Based on fiber diameter, channel count and centre height | Common pitches include 127/250 μm, but the device drawing governs |
Structure and Function
What it usually needs to look like
Commonly narrow Bars, Lids, transparent Spacers, rectangular/round windows, V-groove cover plates, optical path plates with angled end faces, package cover plates with holes and slots, double-sided polished parallel windows or controlled wedge-angle windows.
- Stabilize the relative positions of fibers, chips, lenses or detectors
- Protect devices and adhesive layers and provide a package boundary
- Pass the specified wavelength while controlling reflection, scatter and beam deflection
- Provide insulation, spacing, retention and thermal matching
Performance Requirements
Performance items recommended for confirmation
- Target-wavelength transmittance, surface quality and coating compatibility
- Thickness, parallelism, wedge angle and end face angle
- Groove profile, pitch, assembly reference and accumulated error
- Low chipping, low micro-cracking and edge integrity
- Pre-bonding/pre-coating cleaning and segregated packaging for small parts
Preparing Your Enquiry
Please provide in the drawing or enquiry
Device type, working wavelength, material, length/width/thickness, optical/adhesive/reference faces, surface quality, parallelism or wedge angle, end face angle, groove profile, allowable chipping, coating/lamination/packaging conditions, quantity and packaging arrangement.
The parameters above are for preliminary material and process selection and do not constitute a uniform guarantee for all dimensions, thicknesses and materials. Final specifications, measurement methods and delivery standards are governed by the drawing, samples and order documents confirmed by both parties.
