{"id":18,"date":"2026-08-25T03:53:53","date_gmt":"2026-08-25T03:53:53","guid":{"rendered":"https:\/\/glassubstrate.net\/eagle-xg\/"},"modified":"2026-09-28T09:43:21","modified_gmt":"2026-09-28T09:43:21","slug":"eagle-xg","status":"publish","type":"rg_material","link":"https:\/\/glassubstrate.net\/en\/material\/eagle-xg\/","title":{"rendered":"EAGLE XG\u00ae Glass"},"content":{"rendered":"
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Genuine CORNING\u00ae EAGLE XG\u00ae material<\/div>\n

Corning\u00ae EAGLE XG\u00aeAlkali-free boro-aluminosilicate glass<\/span><\/h1>\n

Formed with Corning's fusion draw process, it combines ultra-low alkali content, an excellent pristine surface, low thermal expansion and high dimensional stability, suited to wafer-level optics, display and microelectronic substrates.<\/p>\n

Request a Material Quote<\/a>Download the official Corning data sheet PDF \u2193<\/a><\/div>\n<\/div>\n<\/div>\n<\/article>\n<\/section>\n
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EAGLE XG\u00ae material supply<\/div>\n

Genuine Corning EAGLE XG\u00ae thin glass supply<\/h2>\n<\/div>\n
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EAGLE XG\u00ae is an alkali-free alkaline earth boro-aluminosilicate glass that contains no heavy metals such as arsenic, antimony or barium. Its thermal expansion is close to that of silicon, and it offers a relatively high strain point, optical transparency, chemical durability and inherent dimensional stability, making it suitable for wafer-level optics, electronic devices and display substrate projects.<\/p>\n<\/div>\n

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Fusion pristine surface<\/strong>During forming the surface does not contact the forming medium, making it suitable for substrate projects sensitive to cleanliness and flatness.<\/span><\/article>\n
Alkali-free and thermally stable<\/strong>Low alkali content, a relatively high strain point and low thermal expansion suit display, optical and microelectronic processes.<\/span><\/article>\n
Wafer and thin-sheet supply<\/strong>Wafers, rectangular sheets and scribed sheets are supported, with prototyping, small-batch and volume delivery.<\/span><\/article>\n<\/div>\n<\/div>\n<\/section>\n
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EAGLE XG\u00ae Material Characteristics<\/h2>\n

Corning's proprietary fusion draw process lets the glass form a flat thin sheet in air with stable thickness control. For wafer-level optics and semiconductor processing, surface roughness, TTV, warpage, edge condition and clean packaging must be confirmed alongside the material grade.<\/p>\n

The material's average coefficient of linear thermal expansion from 0\u2013300 \u00b0C is 3.4 \u00d7 10\u207b\u2076\/\u00b0C and its strain point is 669 \u00b0C; the high thermal stability benefits downstream high-temperature processes. EAGLE XG\u00ae has a total alkali content of about 0.1 wt%, with typical values below 0.05 wt%.<\/p>\n<\/div>\n

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EAGLE XG\u00ae wafers, rectangular thin sheets and machined sample positions<\/figcaption><\/figure>\n<\/div>\n