{"id":285,"date":"2026-09-07T06:16:45","date_gmt":"2026-09-07T06:16:45","guid":{"rendered":"https:\/\/glassubstrate.net\/?post_type=rg_case&#038;p=285"},"modified":"2026-09-28T07:35:37","modified_gmt":"2026-09-28T07:35:37","slug":"%e7%8e%bb%e7%92%83%e6%99%b6%e5%9c%86","status":"publish","type":"rg_case","link":"https:\/\/glassubstrate.net\/en\/case\/%e7%8e%bb%e7%92%83%e6%99%b6%e5%9c%86\/","title":{"rendered":"Glass Wafers"},"content":{"rendered":"<section class=\"rg-hero rg-hero--inner\">\n<article class=\"rg-hero__slide is-active\" data-slide><img decoding=\"async\" class=\"rg-hero__image\" src=\"https:\/\/glassubstrate.net\/wp-content\/uploads\/2026\/08\/codex-clipboard-ba3e93ec-1229-4253-a041-5df24a1688ff.jpg\" alt=\"Glass wafer case study\" fetchpriority=\"high\"><\/p>\n<div class=\"rg-hero__shade\"><\/div>\n<div class=\"rg-container rg-hero__contentwrap\">\n<div class=\"rg-hero__content rg-hero__content--left rg-hero__content--box\">\n<div class=\"rg-hero__eyebrow\">CASE STUDY \u00b7 Wafer-Level Glass Processing<\/div>\n<h1>Glass Wafer Processing Case Study<\/h1>\n<p>For glass discs and wafer substrates, we control material, diameter, thickness, edges, two-sided condition, cleaning and packaging together.<\/p>\n<\/div>\n<\/div>\n<\/article>\n<\/section>\n<p><main class=\"rg-case-study\"><\/p>\n<section class=\"rg-section rg-case-summary\">\n<div class=\"rg-container\">\n<div class=\"rg-case-summary__grid\">\n<div class=\"rg-case-summary__gallery\"><img decoding=\"async\" src=\"https:\/\/glassubstrate.net\/wp-content\/uploads\/2026\/08\/codex-clipboard-ba3e93ec-1229-4253-a041-5df24a1688ff.jpg\" alt=\"Glass wafer processing workshop\" loading=\"lazy\"><img decoding=\"async\" src=\"https:\/\/glassubstrate.net\/wp-content\/uploads\/2026\/08\/a79318a2bd7dd78c985d07c8521098ac.jpg\" alt=\"Glass wafer inspection and delivery\" loading=\"lazy\"><\/div>\n<div class=\"rg-case-summary__copy\">\n<div class=\"rg-eyebrow\">Project Overview<span><\/span><\/div>\n<h2>The complete route from material confirmation to finished-part delivery<\/h2>\n<p>Glass wafers usually serve sensing, microelectronics, optics and packaging projects. Beyond diameter and thickness, attention should go to flatness, thickness variation, edge profile, two-sided appearance, orientation marking and clean packaging, with acceptance defined together with downstream coating, bonding or lithography processes.<\/p>\n<dl class=\"rg-case-facts\">\n<div>\n<dt>Typical materials<\/dt>\n<dd>Fused quartz, BOROFLOAT\u00ae 33, alkali-free glass and others<\/dd>\n<\/div>\n<div>\n<dt>Main operations<\/dt>\n<dd>Disc forming, lapping and polishing, edge processing, cleaning<\/dd>\n<\/div>\n<div>\n<dt>Control focus<\/dt>\n<dd>Diameter, thickness, TTV, edges and two-sided appearance<\/dd>\n<\/div>\n<div>\n<dt>Applications<\/dt>\n<dd>MEMS, sensors, microelectronics and optical packaging<\/dd>\n<\/div>\n<\/dl>\n<p><a class=\"rg-btn rg-btn--blue\" href=\"\/en\/about\/#quote\">Discuss a Similar Project<\/a><\/div>\n<\/div>\n<\/div>\n<\/section>\n<section class=\"rg-rich rg-case-detail-expanded\">\n<div class=\"rg-container\">\n<div class=\"rg-rich__intro\">\n<div class=\"rg-rich__kicker\">ENGINEERING GUIDE<\/div>\n<h2>Derive glass wafer specifications from the downstream process<\/h2>\n<p>A glass wafer is not finished by simply cutting a flat plate into a circle. Downstream lithography, bonding, coating and equipment handling each map to TTV, Bow\/Warp, edge, locating features, surface and particle requirements, all of which must be confirmed together before material is purchased.<\/p>\n<\/div>\n<div class=\"rg-rich__block\">\n<div class=\"rg-rich__kicker\">Applications<\/div>\n<h2>Where it can be used<\/h2>\n<ul>\n<li>MEMS pressure, inertial, acoustic and environmental sensors<\/li>\n<li>Glass-silicon anodic bonding, wafer-level packaging and transparent lids<\/li>\n<li>Microfluidic chips, channel lids and inspection windows<\/li>\n<li>Micro-optical arrays, wafer-level lenses, filtering and optoelectronic devices<\/li>\n<li>Temporary carriers, thin-plate supports, micro-hole and hole-array substrates<\/li>\n<\/ul>\n<\/div>\n<div class=\"rg-rich__block\">\n<div class=\"rg-rich__kicker\">Material Selection Logic<\/div>\n<h2>Why glass<\/h2>\n<p>Glass combines transparency, electrical insulation, chemical stability and adjustable thermal expansion. Different material systems match silicon bonding, low-alkali thin films, UV optics, high-temperature or low-CTE processes respectively.<\/p>\n<\/div>\n<div class=\"rg-rich__block\">\n<div class=\"rg-rich__kicker\">Material Selection<\/div>\n<h2>Common materials and their applications<\/h2>\n<table>\n<thead>\n<tr>\n<th>Material<\/th>\n<th>Applications<\/th>\n<th>Selection focus<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>PYREX\u00ae Micro-Electro<\/td>\n<td>MEMS, anodic bonding and glass-silicon packaging<\/td>\n<td>CTE 3.43 \u00d7 10\u207b\u2076\/\u00b0C\uff080\u2013300\u00b0C\uff09<\/td>\n<\/tr>\n<tr>\n<td>BOROFLOAT\u00ae 33<\/td>\n<td>General wafers, sensing, microfluidics and optical packaging<\/td>\n<td>CTE 3.25 \u00d7 10\u207b\u2076 K\u207b\u00b9, with a wide range of available specifications<\/td>\n<\/tr>\n<tr>\n<td>EAGLE XG\u00ae<\/td>\n<td>Low-alkali, thin-film, display and thin wafers<\/td>\n<td>Low total alkali, high strain point and good pristine surface quality<\/td>\n<\/tr>\n<tr>\n<td>Fused quartz \/ JGS1<\/td>\n<td>UV, laser, high-temperature, low-CTE and high-purity applications<\/td>\n<td>Confirm the spectrum, hydroxyl, impurities and internal quality<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<div class=\"rg-rich__block\">\n<div class=\"rg-rich__kicker\">Typical Parameters<\/div>\n<h2>Common enquiry parameters<\/h2>\n<table>\n<thead>\n<tr>\n<th>Item<\/th>\n<th>Common starting points or wording<\/th>\n<th>Engineering notes<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Diameter<\/td>\n<td>Commonly 100, 150, 200, 300 mm<\/td>\n<td>Compatible with equipment, chucks, cassettes and layout<\/td>\n<\/tr>\n<tr>\n<td>Thickness<\/td>\n<td>Commonly 0.20, 0.30, 0.40, 0.50, 0.70, 0.85, 1.10 mm<\/td>\n<td>Stock and tolerances differ by material<\/td>\n<\/tr>\n<tr>\n<td>TTV<\/td>\n<td>Standard discussion from \u226410-25 \u03bcm; precision bonding can be evaluated to \u22641-5 \u03bcm<\/td>\n<td>PYREX\u00ae wafers can be evaluated to \u22641 \u03bcm<\/td>\n<\/tr>\n<tr>\n<td>Bow\/Warp<\/td>\n<td>Defined individually by equipment and process<\/td>\n<td>State the measurement face, support and edge exclusion<\/td>\n<\/tr>\n<tr>\n<td>Surface roughness<\/td>\n<td>Coating\/lithography\/bonding faces are defined by Ra or process compatibility<\/td>\n<td>The published Ra of the EAGLE XG\u00ae pristine surface is \u226410 \u00c5<\/td>\n<\/tr>\n<tr>\n<td>Edge<\/td>\n<td>Chamfered, rounded or specified profile<\/td>\n<td>State front\/back, edge exclusion and maximum chipping<\/td>\n<\/tr>\n<tr>\n<td>Hole arrays<\/td>\n<td>Hole diameter, pitch, taper, inlet\/outlet chipping and position tolerance<\/td>\n<td>Laser processes must be validated against material thickness and samples<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<div class=\"rg-rich__block\">\n<div class=\"rg-rich__kicker\">Structure and Function<\/div>\n<h2>What it usually needs to look like<\/h2>\n<p>Available as standard round wafers, discs with Flat\/Notch, rectangular carriers, wafers with hole arrays or windows, double-sided polished wafers, single-side functional wafers and bonding lid wafers.<\/p>\n<ul>\n<li>As substrates for thin films, lithography, bonding and packaging<\/li>\n<li>As transparent lids, carriers and insulating layers<\/li>\n<li>Carrying micro-holes, channels or micro-optical structures<\/li>\n<li>Provide a stable geometric reference for equipment handling and processing<\/li>\n<\/ul>\n<\/div>\n<div class=\"rg-rich__block\">\n<div class=\"rg-rich__kicker\">Performance Requirements<\/div>\n<h2>Performance items recommended for confirmation<\/h2>\n<ul>\n<li>Material CTE, strain point, dielectric and spectral matching<\/li>\n<li>Low TTV, controlled Bow\/Warp and stable thickness<\/li>\n<li>Low roughness, low particles and controlled surface defects<\/li>\n<li>Edge profile, locating features and equipment compatibility<\/li>\n<li>Lot material documents, inspection records and clean packaging<\/li>\n<\/ul>\n<\/div>\n<div class=\"rg-rich__block\">\n<div class=\"rg-rich__kicker\">Preparing Your Enquiry<\/div>\n<h2>Please provide in the drawing or enquiry<\/h2>\n<p>Material grade, wafer diameter, thickness, TTV, Bow\/Warp, Flat\/Notch, edge profile, A\/B faces, surface grade, hole array drawing, edge exclusion, downstream lithography\/bonding\/coating conditions, cleanliness requirements, quantity and packaging.<\/p>\n<p><small>The parameters above are for preliminary material and process selection and do not constitute a uniform guarantee for all dimensions, thicknesses and materials. Final specifications, measurement methods and delivery standards are governed by the drawing, samples and order documents confirmed by both parties.<\/small><\/p>\n<\/div>\n<\/div>\n<\/section>\n<section class=\"rg-case-process\">\n<div class=\"rg-container\">\n<div class=\"rg-case-process__layout\">\n<div>\n<article class=\"rg-case-step\">\n<div class=\"rg-case-step__copy\"><span class=\"rg-case-step__ghost\">01<\/span><\/p>\n<h2>Wafer specification confirmation<\/h2>\n<p>Confirm material, diameter, thickness, flat or notch, effective area and downstream processes.<\/p>\n<\/div>\n<div class=\"rg-case-step__media rg-case-step__media--pair\"><img decoding=\"async\" src=\"https:\/\/glassubstrate.net\/wp-content\/uploads\/2026\/08\/codex-clipboard-ba3e93ec-1229-4253-a041-5df24a1688ff.jpg\" alt=\"Glass wafer processing and material preparation\" loading=\"lazy\"><img decoding=\"async\" src=\"https:\/\/glassubstrate.net\/wp-content\/uploads\/2026\/08\/a79318a2bd7dd78c985d07c8521098ac.jpg\" alt=\"Glass wafer processing inspection\" loading=\"lazy\"><\/div>\n<\/article>\n<article class=\"rg-case-step\">\n<div class=\"rg-case-step__copy\"><span class=\"rg-case-step__ghost\">02<\/span><\/p>\n<h2>Disc and edge forming<\/h2>\n<p>Establish the circular outline and edge structure, reducing edge chipping and later handling risk.<\/p>\n<\/div>\n<\/article>\n<article class=\"rg-case-step\">\n<div class=\"rg-case-step__copy\"><span class=\"rg-case-step__ghost\">03<\/span><\/p>\n<h2>Lapping and double-sided processing<\/h2>\n<p>Lapping or double-sided polishing is carried out according to thickness, parallelism and surface requirements.<\/p>\n<\/div>\n<\/article>\n<article class=\"rg-case-step\">\n<div class=\"rg-case-step__copy\"><span class=\"rg-case-step__ghost\">04<\/span><\/p>\n<h2>Clean inspection and packaging<\/h2>\n<p>Check dimensions, edges, two-sided appearance and cleanliness, and package according to handling and downstream process requirements.<\/p>\n<\/div>\n<\/article>\n<\/div>\n<aside class=\"rg-case-sidebar\">\n<section>\n<h3>\u9879\u76ee\u63a7\u5236\u91cd\u70b9<\/h3>\n<p>\u6750\u6599\u3001\u5c3a\u5bf8\u3001\u8fb9\u7f18\u3001\u8868\u9762\u4e0e\u6d01\u51c0\u8981\u6c42\u9700\u8981\u5728\u52a0\u5de5\u524d\u7edf\u4e00\u786e\u8ba4\u3002<\/p>\n<\/section>\n<section>\n<h3>Related Pages<\/h3>\n<p><a class=\"rg-link\" href=\"\/en\/material\/fused-silica\/\">\u7194\u878d\u77f3\u82f1\u73bb\u7483 \u2192<\/a><\/p>\n<p><a class=\"rg-link\" href=\"\/en\/processing\/glass-polishing\/\">\u73bb\u7483\u629b\u5149 \u2192<\/a><\/p>\n<p><a class=\"rg-link\" href=\"\/en\/case-studies\/\">\u8fd4\u56de\u6848\u4f8b\u5206\u6790 \u2192<\/a><\/p>\n<\/section>\n<section>\n<h3>Preparing Your Enquiry<\/h3>\n<p>\u8bf7\u63d0\u4f9b\u6750\u6599\u724c\u53f7\u3001\u5c3a\u5bf8\u3001\u539a\u5ea6\u3001\u6570\u91cf\u3001\u56fe\u7eb8\u3001\u516c\u5dee\u3001\u8868\u9762\u4e0e\u4ea4\u671f\u8981\u6c42\u3002<\/p>\n<p><a class=\"rg-btn rg-btn--blue\" href=\"\/en\/about\/#quote\">Contact Us<\/a><\/section>\n<\/aside>\n<\/div>\n<\/div>\n<\/section>\n<section class=\"rg-cta-band\">\n<div class=\"rg-container rg-cta-band__inner\">\n<div>\n<h2>Start material selection and processing requirements from the same drawing<\/h2>\n<p>Send the drawing and key acceptance items and we will assess the project together with the material and process route.<\/p>\n<\/div>\n<div class=\"rg-cta-band__actions\"><a class=\"rg-btn rg-btn--outline\" href=\"mailto:jerry-ton@lightingglass.cn?subject=%E7%8E%BB%E7%92%83%E6%99%B6%E5%9C%86%E9%A1%B9%E7%9B%AE%E8%AF%A2%E4%BB%B7\">Email Your Drawings<\/a><a class=\"rg-btn rg-btn--outline\" href=\"\/en\/about\/#quote\">Contact the Engineering Team<\/a><\/div>\n<\/div>\n<\/section>\n<p><\/main><\/p>","protected":false},"excerpt":{"rendered":"<p>CASE STUDY \u00b7 \u6676\u5706\u7ea7\u73bb\u7483\u52a0\u5de5 \u73bb\u7483\u6676\u5706\u52a0\u5de5\u6848\u4f8b \u9488\u5bf9\u73bb\u7483\u5706\u7247\u548c\u6676\u5706\u57fa\u677f\uff0c\u534f\u540c\u63a7\u5236\u6750\u6599\u3001\u76f4\u5f84\u3001\u539a\u5ea6\u3001 [&hellip;]<\/p>\n","protected":false},"featured_media":356,"menu_order":0,"template":"","class_list":["post-285","rg_case","type-rg_case","status-publish","has-post-thumbnail","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.5 - 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