{"id":278,"date":"2026-09-07T05:43:15","date_gmt":"2026-09-07T05:43:15","guid":{"rendered":"https:\/\/glassubstrate.net\/?post_type=rg_case&p=278"},"modified":"2026-09-28T07:39:22","modified_gmt":"2026-09-28T07:39:22","slug":"%e5%8d%8a%e5%af%bc%e4%bd%93","status":"publish","type":"rg_case","link":"https:\/\/glassubstrate.net\/en\/case\/%e5%8d%8a%e5%af%bc%e4%bd%93\/","title":{"rendered":"Semiconductor"},"content":{"rendered":"
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\"Semiconductor<\/p>\n
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CASE STUDY \u00b7 Semiconductor and Microelectronics Glass<\/div>\n

Semiconductor Industry Processing Case Study<\/h1>\n

For carriers, lids, wafers and micro-hole glass in semiconductor, MEMS and microelectronics projects, we plan material, precision processing and clean delivery as one workflow.<\/p>\n<\/div>\n<\/div>\n<\/article>\n<\/section>\n

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\"Semiconductor\"Semiconductor<\/div>\n
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Project Overview<\/span><\/div>\n

The complete route from material confirmation to finished-part delivery<\/h2>\n

Semiconductor-related glass parts often focus on thermal expansion, thickness uniformity, micro-holes or hole arrays, two-sided condition and cleanliness. Material selection must match downstream processes such as lithography, bonding, coating, packaging or inspection.<\/p>\n

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Typical components<\/dt>\n
Glass wafers, carriers, lids, micro-hole arrays, packaging windows<\/dd>\n<\/div>\n
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Main operations<\/dt>\n
Precision cutting, drilling, lapping and polishing, cleaning, inspection<\/dd>\n<\/div>\n
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Control focus<\/dt>\n
CTE, TTV, hole positions, surface, particles and traceability<\/dd>\n<\/div>\n
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Applications<\/dt>\n
MEMS, sensors, microelectronics and semiconductor equipment<\/dd>\n<\/div>\n<\/dl>\n

Discuss a Similar Project<\/a><\/div>\n<\/div>\n<\/div>\n<\/section>\n

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ENGINEERING GUIDE<\/div>\n

Confirm the process first, then the glass<\/h2>\n

A glass wafer of the same size has different requirements as a carrier, an anodic bonding lid, a lithography substrate, a micro-hole interposer or an equipment window. Material name, process temperature, geometric specification, surface and packaging must be confirmed together.<\/p>\n<\/div>\n

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Applications<\/div>\n

Where it can be used<\/h2>\n